Shenzhen Angpai Technology Co., Ltd. was established in 2010 and is a high-quality provider specializing in thermal management solutions, particularly occupying a dominant position in the field of chip level liquid cooling modules. The company is headquartered in Longhua District, Shenzhen, and has long been committed to the research and development of high-power chip liquid cooling heat dissipation, precision temperature control systems, and new energy vehicle thermal management systems. It has over 200 innovative technology patents. Angpai's Dongguan factory covers an area of 20000 square meters and is equipped with cutting-edge fully automated production lines, serving as a high-tech enterprise and specialized in precision and innovation; Little Giant "; Angpai has established close industry university research cooperation relationships with universities such as South China University of Technology and Xi'an Jiaotong University, and actively promoted the construction of provincial laboratories and engineering centers. Its products are widely used in consumer electronics IDC、 Our business covers multiple fields such as healthcare, industrial control, charging, energy storage, and new energy vehicles, covering major economic regions around the world. In 2024, Angpai invested in the construction of an automated assembly plant covering an area of approximately 8000 square meters in Thailand to optimize delivery methods for overseas customers.
20 +
Industry experience
200 +
Patent authentication
5 M/pcs
Annual production capacity
Product Center
Open loop series
Closed loop series
GPU series
Esports/DIY Series
AIO series
Medical Series
Lighting Series
Industrial Control Series
Energy storage series
Charging gun series
Charging pile series
Heat pump compressor
DC pump
DC fan









Angpai Technology Co., Ltd. Video Information
Factory video introduction
View detailsEnterprise Information2025-02-04

New liquid cooling series products launched
Shenzhen Angpai Technology Co., Ltd. has long been committed to the research and development of high-power chip liquid cooling heat dissipation, precision temperature control systems, and new energy vehicle thermal management systems. We are now launching new products on the market
View detailsEnterprise Information2025-02-04
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