The 2026 Shenzhen International AI Computing Industry Exhibition and the 6th Data Center Liquid Cooling Technology Exhibition kicked off with a heavy curtain, empowering the green upgrading of the computing industry
⏰ 2026-06-02
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From June 10th to 12th, 2026, the Shenzhen International AI Computing Industry Exhibition and the 6th Shenzhen International Data Center Liquid Cooling Technology Exhibition will be grandly held at the Shenzhen International Convention and Exhibition Center (Bao'an New Hall). The two exhibitions will be carried out in conjunction and deeply integrated, focusing on core areas such as AI computing infrastructure innovation, data center green heat dissipation, and industrial application of liquid cooling technology. They will gather high-quality resources from the global industrial chain, create a professional and authoritative industry event in the field of computing power and liquid cooling technology in the Greater Bay Area, and help promote the low-carbon, intelligent, and high-speed development of China's digital infrastructure. The following is a summary of the core authoritative information of the exhibition.
1、 Exhibition Basic Core Information
1. Event time: June 10th to June 12th, 2026, lasting for three days, covering the entire cycle of industry procurement, technical exchange, and business docking scenarios.
2. Venue: Shenzhen International Convention and Exhibition Center (No.1 Zhancheng Road, Fuhai Street, Bao'an District), leveraging the advantages of the Greater Bay Area digital industry cluster, radiating to the national and even overseas computing power and data center industry markets.
3. Exhibition positioning: A benchmark professional exhibition in the field of computing power and liquid cooling and heat dissipation in China. Among them, the Shenzhen International Data Center Liquid Cooling Technology Exhibition has been successfully held for five sessions, and the sixth upgraded iteration will be held in 2026, focusing on solving the high energy consumption and high heat dissipation problems of data centers in AI high computing power scenarios; The AI computing industry exhibition held at the same time focuses on the landing of innovative achievements in the entire industry chain, and the dual exhibition linkage builds an integrated display system of "computing hardware+heat dissipation technology+scene application".
4. Simultaneous Exhibition: Jointly hold the 16th Shenzhen International Thermal Insulation and Heat Dissipation Materials and Equipment Exhibition, with three exhibitions complementing each other and improving the display layout of the entire computing power heat dissipation industry chain.
5. Target audience: Accurately covering professional audiences such as data center operators, AI technology companies, computing power service providers, new energy enterprises, semiconductor equipment manufacturers, research institutions, engineering construction and investment and financing institutions, covering diverse application fields such as industrial manufacturing, finance, healthcare, autonomous driving, and low altitude economy.
2、 Core exhibition scope
The exhibits at this exhibition cover the entire AI computing power industry chain and the data center liquid cooling technology system, with comprehensive sub categories that meet the industry's needs. Specifically, they are divided into two core sections:
1. AI computing industry: focus on intelligent computing infrastructure and core software and hardware, exhibit AI chips, GPU/DPU/CPU computing chips, memory chips, edge computing devices, supercomputing centers, intelligent computing center infrastructure, servers, network transmission equipment, cloud computing services, computing security systems, AI big model industry application solutions and other core products, and display supporting services such as computing scheduling, computing leasing, intelligent operation and maintenance for multiple scenarios.
2. Data center liquid cooling technology sector: includes a full range of liquid cooling technologies and supporting equipment, including three mainstream technology solutions: cold plate liquid cooling, immersion liquid cooling (single-phase/two-phase), and spray liquid cooling; Exhibiting liquid cooling raw materials such as fluorinated liquids, mineral oils, coolants, and refrigerants; Core components such as cold plates, liquid circulation equipment, temperature control components, leakage detection equipment, and intelligent sensors; And supporting products such as liquid cooled pipeline connectors, auxiliary heat dissipation equipment, phase change heat dissipation materials, etc., while showcasing the overall solution for ultra-low PUE liquid cooled data centers.
3、 Core highlights of the exhibition
1. Focusing on industry pain points and aligning with the dual carbon trend: Currently, AI big models and supercomputing scenarios are driving a significant increase in computing power density for single cabinets. Traditional air-cooled cooling modes are no longer able to meet high computing power cooling needs and have high energy consumption. This exhibition focuses on liquid cooling energy-saving technology, showcasing innovative solutions that can significantly reduce the PUE value of data centers, accurately meeting the requirements for green and low-carbon transformation and development of data centers under the national "dual carbon" strategy.
2. Top companies gather, with high technological value: The exhibition attracts top companies in industries such as Gree, as well as specialized and new enterprises in the fields of computing power and liquid cooling at home and abroad to participate. It focuses on releasing cutting-edge achievements such as the new generation of high computing power hardware, efficient liquid cooling technology, and lightweight energy-saving solutions for 2026, showcasing the latest technological iteration direction in the industry.
3. Full industry chain closed-loop display: from upstream computing chips and heat dissipation raw materials, to midstream liquid cooling equipment and computing infrastructure, and then to downstream industry scenario applications, operation and maintenance services, and industrial investment and financing, achieving full chain coverage and connecting the industrial closed-loop of technology research and development, product landing, and market docking.
4. Accurate Business Matching Attribute: The exhibition has been deeply rooted in the industry for many years, accumulating a massive amount of professional procurement resources. It specifically invites government and enterprise procurement parties, engineering service providers, and system integrators to negotiate and build a professional platform for product display, technical exchange, channel expansion, and project cooperation for participating enterprises.
4、 Supporting industry activities during the same period
During the exhibition, multiple high-end industry supporting activities will be held simultaneously, bringing together academicians, experts, corporate executives, industry scholars, and technical engineers for in-depth discussions. The core activities include the Computing Industry Innovation and Development Forum, the Liquid Cooling Technology Industrialization Application Summit, the Green Data Center Low Carbon Development Exchange Conference, the New Product Technology Release Conference, and the Industry Chain Supply and Demand Matchmaking Conference. The event focuses on hot topics such as the construction of a national integrated computing power network, coordinated development of computing and electronics, cost optimization of liquid cooling technology, and solving heat dissipation problems in high computing power scenarios, sharing cutting-edge trends and practical experience in the industry.
5、 Industry Value and Development Significance
1. Assisting industrial technology upgrading: The exhibition focuses on showcasing cutting-edge AI computing power and liquid cooling technology, accelerating the transformation of high computing power, low energy consumption, and green technology achievements, promoting the iterative upgrade of data centers from traditional air cooling to high-efficiency liquid cooling mode, and breaking the development bottleneck of "high computing power and high energy consumption" in the computing industry.
2. Improving the computing power industry ecosystem in the Greater Bay Area: Leveraging Shenzhen's digital industry location advantages, integrating domestic and foreign computing power and liquid cooling industry chain resources, strengthening the advantages of the Greater Bay Area's intelligent computing power industry cluster, and helping the Greater Bay Area build a national benchmark for green computing power industry.
3. Empowering high-quality development of the digital economy: Computing power, as the core productivity of the digital economy, will be promoted through technical exchanges and industry integration at this exhibition. It will facilitate efficient allocation of computing power resources and large-scale construction of green computing power infrastructure, providing solid computing power support for the development of emerging industries such as artificial intelligence, industrial digitization, and low altitude economy.
4. Building an international exchange platform: Establishing channels for communication between domestic and foreign computing power and liquid cooling technology, promoting technological cooperation and trade between domestic and foreign enterprises, driving China's green computing power and liquid cooling technology towards the international market, and enhancing the industry's international competitiveness.
It is reported that this exhibition will continue to optimize exhibition and viewing services, open up precise supply and demand matching, technical consulting, new product display and other diversified services, and make every effort to create a highly influential industry event for computing power and liquid cooling industry in 2026, injecting new momentum into the green and high-quality development of China's digital infrastructure.
