2026-04-17
2026-12-02 - 2026-12-04
香港线路板协会
Musical Instruments/Games/Communication/Electronics
Shenzhen, GD
Shenzhen International Exhibition Center
Thank you for applying to participate in this exhibition. You only need to fill in the basic information to complete the application process. If you need further information, our service specialist will contact you via email.
After you submit your application, we will send a successful submission email to your email address to indicate that we have received your application. Please ensure the validity of your email address.
In addition to providing you with tickets and exhibition services, we can also offer more personalized services such as business travel services to make your experience more convenient and easy. If you have any questions or more needs about coming to China for conferences/exhibitions, please feel free to contact us at any time.
Please refer to the bottom of the page for details
Thank you for applying to participate in this exhibition. You only need to fill in the basic information to complete the application process. If you need further information, our service specialist will contact you via email.
After you submit your application, we will send a successful submission email to your email address to indicate that we have received your application. Please ensure the validity of your email address.
In addition to providing you with tickets and exhibition services, we can also offer more personalized services such as business travel services to make your experience more convenient and easy. If you have any questions or more needs about coming to China for conferences/exhibitions, please feel free to contact us at any time.
Please refer to the bottom of the page for details
随着生成式人工智能、算力基础设施和高性能计算需求的持续攀升，全球电子
产业正迎来由AI主导的结构性增长新周期。据中研普华预测，2025年全球PCB
市场规模预计将达到968亿美元，年均复合增长率约5.8%，增长动能显著提升。
技术层面，高密度互连 (HDI)、IC 载板、先进封装基板、类载板(SLP)、高速
高频材料等高端 PCB 正成为 AI 应用场景的核心需求。同时，AI也深度赋能制
造环节——智能质检、预测性维护与智能排产技术正在显著提升生产效率与良
率。
在这一双重驱动下，AI 不仅为 PCB 行业带来量的增长，更推动其向高附加
值、高技术含量的方向跃升。2026年国际电子电路（深圳）展览会 (HKPCA
Show) 将深度聚焦这一趋势，以“AI 驱动科技”为主题助力行业领先企业捕捉
AI 驱动的战略机遇。
1. PCB 产品：刚性 / 柔性 / 软硬结合板、高密度互联板（HDI）、IC 封装载板、特种 PCB 等
2. 生产设备：曝光机、钻孔机、电镀设备、检测设备、自动化产线、智能制造解决方案
3. 材料与化学品：铜箔、覆铜板、油墨、干膜、化学药水、辅材耗材
4. 电子组装与封测：SMT 设备、PCBA 制程、测试仪器、半导体封装技术
5. 应用领域：汽车电子、通讯、消费电子、工业 / 医疗、航空航天等下游应用
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