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2026 International Electronic Circuit (Shenzhen) Exhibition
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Release time: 2026-04-17
Exhibition time: 2026-12-02 - 2026-12-04
Host: Hong Kong Circuit Board Association
Exhibition industry: Musical Instruments/Games/Communication/Electronics
Exhibition City: Shenzhen, GD
Exhibition Hall Name: Shenzhen International Exhibition Center
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Exhibition Introduction

With the continuous rise in demand for generative artificial intelligence, computing infrastructure, and high-performance computing, global electronics
The industry is ushering in a new cycle of structural growth led by AI. According to the prediction of Zhongyan Puhua, the global PCB market is expected to reach 2025
The market size is expected to reach 96.8 billion US dollars, with an average annual compound growth rate of about 5.8%, indicating a significant increase in growth momentum.

On the technical level, high-density interconnect (HDI), IC carrier board, advanced packaging substrate, class carrier board (SLP), high-speed
High frequency materials and other high-end PCBs are becoming the core requirements for AI application scenarios. At the same time, AI also deeply empowers manufacturing
The manufacturing process - intelligent quality inspection, predictive maintenance, and intelligent scheduling technology are significantly improving production efficiency and efficiency
Rate.

Under this dual driving force, AI not only brings volume growth to the PCB industry, but also drives it towards high value-added
The direction of value and high-tech content has surged. 2026 International Electronic Circuit (Shenzhen) Exhibition (HKCCA)
Show will deeply focus on this trend, with the theme of "AI driven technology" to help industry-leading enterprises capture it
Strategic opportunities driven by AI.

Scope of exhibits

1. PCB productsRigid/flexible/soft hard combination board, high-density interconnect board (HDI), IC packaging carrier board, special PCB, etc

2. production equipmentExposure machine, drilling machine, electroplating equipment, testing equipment, automated production line, intelligent manufacturing solutions

3. Materials and ChemicalsCopper foil, copper-clad laminate, ink, dry film, chemical solution, auxiliary materials and consumables

4. Electronic assembly and packaging testingSMT equipment, PCBA process, testing instruments, semiconductor packaging technology

5. Application DomainDownstream applications such as automotive electronics, communications, consumer electronics, industrial/medical, aerospace, etc

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2026 International Electronic Circuit (Shenzhen) Exhibition
  • Exhibition data
  • Exhibition Introduction
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  • Exhibition pictures
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