The 2026 Bay Area Semiconductor Industry Ecological Expo (referred to as "WESEMiBAY 2026") will be held from October 14th to 16th at the Shenzhen Convention and Exhibition Center (Futian), based on the industrial advantages of the Guangdong Hong Kong Macao Greater Bay Area, to create a high-level ecological industry event in the domestic integrated circuit field.

This exhibition is guided by China International Engineering Consulting Co., Ltd., jointly organized by Shenzhen Semiconductor and Integrated Circuit Industry Alliance (SICA) and Shenzhen Major Industry Investment Group Co., Ltd., hosted by Shenzhen Xinmeng Exhibition Co., Ltd., and supported by multiple research platforms and leading enterprises such as the Third Generation Semiconductors National Technology Innovation Center, China Open Instruction Ecology (RISC V) Alliance, China Resources Microelectronics, Pengxin Microelectronics, and SMIC (Shenzhen), gathering industrial innovation forces to participate in the Bay Core Exhibition. The exhibition implements the work deployment of "one cluster, one exhibition" for Shenzhen's "20+8" industrial cluster, relying on the vast application market of the Greater Bay Area and the resources of major industrial project clusters of Shenzhen Investment, and is committed to serving Shenzhen's goal of building the "third pole" of national integrated circuit industry development.

It is reported that the exhibition area of this year's Wanxin Exhibition exceeds 70000 square meters, and it is expected to gather more than 800 domestic and foreign exhibitors, attracting more than 70000 professional visitors to visit and exchange ideas, reaching a new high in scale. The exhibition area is divided into four core sections: IC design/AI infrastructure, wafer manufacturing, compound semiconductors, and advanced packaging, covering the entire chain of semiconductor materials, core components, equipment, and testing services. It focuses on showcasing cutting-edge technologies and mass-produced products such as third-generation semiconductors, RISC V architecture, Chiplets, and AI computing chips, presenting innovative achievements in the domestic integrated circuit industry in all aspects.

In addition to exhibitions and displays, the 2026 Bay Area Semiconductor Conference will also be held at the same time, with more than 30 high-level forum activities, including the Industry Development Summit, Integrated Circuit Science and Technology Conference, multiple vertical technology seminars, new product releases, project docking, and dual recruitment and attraction activities. Industry academicians and experts, top enterprise executives, and investment institution representatives will be invited to jointly analyze industry trends, open up closed-loop channels for technology research, achievement transformation, industry investment, and talent exchange, and build a healthy development ecology for semiconductors from the four dimensions of industry, technology, capital, and talent.

As a benchmark exhibition for domestic integrated circuit independent brands, Wanxin Exhibition focuses on building a five in one comprehensive service platform of "exhibition display+summit forum+award list+double recruitment and double introduction+research report", promoting efficient connection between upstream and downstream of the industrial chain, and promoting central local collaboration and deep integration of industry, academia, research and application. The exhibition links with research institutions such as the National Technology Innovation Center for Third Generation Semiconductors, Pinghu Laboratory, and RIOS Laboratory of Tsinghua Berkeley Shenzhen Research Institute, as well as leading enterprises such as China Resources Microelectronics, Pengxin Microelectronics, Shengweixu, and SMIC (Shenzhen), to open up channels for innovative achievements and help high-level technological self-reliance and self-improvement.

Wafer Manufacturing

Wafer manufacturing equipment, etching equipment, measuring equipment, etc

Wafer manufacturing materials, wafers, chemicals, photolithography materials, etc

Components, metals, valves, pumps, vacuum systems, etc

Factory and other services

Compound semiconductor

silicon carbide(SiC)/gallium nitride(GaN)/gallium arsenide(GaAS)/gallium oxide(Ga2O3)/Diamond, etc

Compound semiconductor equipment, crystal growth equipment, epitaxial equipment, etc

Compound semiconductor materials, substrate materials, epitaxial materials, etc

Compound Device Design

Compound Semiconductor Manufacturing Services

ICdesign/AIInfrastructure

ICdesign/AIInfrastructure Exhibition Area

AIChip and Computing Architecture

Server and Intelligent Computing Center

Cloud network storage and data

EDA/Power liquid cooling and green computing power

Software and Model Infrastructure

Physical AIIndustry Applications

Advanced Packaging

Packaging testing manufacturer

Encapsulation testing equipment

Packaging material

Glass substrate and process

Components and indirect consumables

Green factory affairs and supporting facilities