The guest lineup of the IICIE International Integrated Circuit Innovation Expo landing at the Shenzhen Summit Forum in September has been officially announced
The 2026 IICIE International Integrated Circuit Innovation Expo will be held from September 9th to 11th at the Shenzhen International Convention and Exhibition Center (Bao'an). This grand event is hosted by CIOE China Optoelectronics Expo and jointly organized by Aijiwei (Shanghai) Technology Co., Ltd. and Shenzhen Herong Semiconductor Exhibition Co., Ltd. With the theme of "Cross border Integration and Full Chain Collaboration to Build a Characteristic Chip Ecology", it aims to build a high-end exhibition and communication platform for the entire integrated circuit industry chain, gather industry strength, and explore the path of collaborative innovation and development in the semiconductor industry.
As the core flagship event of the Expo, the opening ceremony and Integrated Circuit Innovation Summit Forum are scheduled to be held on September 9th. The forum will gather representatives from government, research institutions, industry, and application sectors to engage in high-level industry dialogues around the current development status of the semiconductor industry, and gather wisdom from multiple parties for the high-quality development of the domestic integrated circuit industry.
At present, the global semiconductor industry is in a stage of deep transformation. AI、 Emerging scenarios such as advanced computing and automotive electronics continue to release market growth, and the independent and controllable industrial chain, as well as cross disciplinary integration and collaboration, have become the mainline of industry development. Entering the post Moore era, AI chip iteration and upgrading, breakthroughs in advanced packaging technology, localization of equipment and materials, and construction of computing infrastructure have ushered in new development windows, and have also raised higher standards for collaborative innovation across the entire industry chain.
The reporter learned that the summit forum will be chaired by Chen Wei, President of Guangdong Integrated Circuit Association, and the event will also invite academicians, experts, and industry association leaders to give speeches. Representatives from top companies such as Tongfu Micro Calcium Carbide Lei, Huada Jiutian Liu Weiping, Qualcomm Meng Pu, Wuhan Xinxin Sun Peng, Muxi Integrated Chen Weiliang, and Zhongke Feice Chen Lu will deliver keynote speeches, presenting industry perspectives on key areas such as packaging and testing, EDA tools, global industrial cooperation, wafer manufacturing, intelligent computing power, and semiconductor testing equipment.
The afternoon session of the forum was also packed with practical content, covering multiple industry hot topics, including advanced packaging of AI chips, innovation in integrated circuits in the commercial aerospace field, post Moore era chip design paradigms, key materials for integrated circuits, development of special gases, chip security protection in the era of intelligent agents, and innovative practices in domestic chips. Industry executives such as Jia Zhaowei from Shengmei Semiconductor, Chen Jie from Ziguang Guoxin, Guo Wei from Shanghai Oriental Computing, Li Wei from Shanghai Silicon Industry Group, Ding Cheng from CSSC Perry, Pi Bo from Huiding Technology, Yu Jian from Fudan Microelectronics, and Zhu Wanyan from Aijiwei will share their insights one by one. The content will cover the entire industry chain of chip design, manufacturing, packaging and testing, equipment, materials, and security applications, analyzing industry opportunities and existing challenges from multiple perspectives.
According to the organizer, this forum closely focuses on the actual pain points of the industry, takes into account both international perspectives and domestic industry implementation practices, connects communication channels between upstream and downstream enterprises, promotes the collision of ideas in different fields, and facilitates the flow and docking of technology, experience, and industrial resources. After the forum, attendees can also visit the exhibition area of the expo, engage in industry docking and exchange, and achieve the two-way implementation of ideological discussions and business cooperation.
The current IICIE International Integrated Circuit Innovation Expo will continue to be held at the Shenzhen International Convention and Exhibition Center (Bao'an) from September 9-11. The exhibition is open to all industry practitioners, who can register to participate in relevant conferences and exhibition activities, jointly explore new directions for the development of the integrated circuit industry, and build a characteristic integrated circuit industry ecosystem.
