Chip Design/Wafer Manufacturing Exhibition Area

Integrated circuit design and chips EDA、MCU、 Wafer manufacturing and equipment and components, etc

Chiplet and Advanced Packaging Exhibition Area

Chiplet, SiP packaging, wafer level packaging (WLP), 3D packaging, panel level packaging (PLP), TSV/TGV packaging, organic/silicon/glass substrates, packaging substrates, packaging carriers, IC carriers, semiconductor packaging materials and equipment, etc

Exhibition Area for Semiconductor Specialized Equipment/Components

Thinning machine, single crystal furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, cleaning equipment, cutting machine, mounting machine, bonding machine, testing machine, sorting machine, probe station and components, etc

Advanced Materials/Carbon Materials/Diamond Semiconductor Exhibition Area

Silicon wafers and silicon-based materials, photomasks, electronic gases, photoresist and its supporting reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, ceramic substrates, chip bonding materials, carbon based materials, diamond semiconductors, graphite materials, superhard materials, etc

Third Generation Semiconductor Exhibition Area

nitriding(GaN)And silicon carbide(SiC)Zinc oxide(Zno)Diamond, wafer, substrate and epitaxy, power devicesIGBTPackaging materials, RF devices, and processing equipment, etc

Component Exhibition Area

Passive components, semiconductor discrete devices/1GBT, 5G core components, special electronics, component power management, sensors, memory, connector relays, cables, plug-in devices, crystal oscillators, resistors, display devices, diodes, transistor filtering components, switches and component materials and equipment

Power Devices/Power Electronics/Automotive Semiconductors Exhibition Area

Automotive grade semiconductor control/computing chips, power semiconductors (IGBT and MOSFET), automotive grade SiC modules, power management chips, automotive electronic micro assembly and power devices, packaging and testing equipment, automation equipment, etc

computing power Storage, artificial intelligence, and CPO co packaging exhibition area

Artificial intelligence chips, solutions, computing power chips and solutions, algorithm solutions, data storage, optoelectronic co packaging modules and technologies and equipment, etc

Semiconductor Display/Mini/Micro LED Exhibition Area

OLED, AMOLED, Mini/Micro LED displays, flexible displays, materials and equipment, etc

International Brand Zone

International semiconductor material suppliers, well-known equipment suppliers, well-known packaging and testing, manufacturing, contract manufacturers, etc