In recent years, with the explosive growth of big data, the data throughput and computational load required by data centers have significantly increased, making the data center industry increasingly demanding servers. However, due to the limited area of data center construction and environmental regulations, the server carrying capacity of existing data centers in China is relatively limited, and they need to continuously increase the power density of single cabinets to accommodate the rapidly growing demand for computing power. With the rapid development of data centers, energy consumption has become an undeniable issue in the development of the data center industry. Especially after the release of the dual carbon targets of "peak carbon emissions by 2030 and carbon neutrality by 2060", the guidance of national policies and future regulation have become strong driving forces for energy conservation and consumption reduction in data centers. How to better reduce data center PUE has become a focus and challenge in the industry. Based on its efficient technological advantages, liquid cooling has become a pioneer in further reducing PUE in data centers.
With the development of 5G technology, edge computing, AI and other applications, the power density of single cabinet will become higher and higher, and the proportion of liquid cooling in industrial applications will become larger and larger. Although the trend is good, we also clearly see that the entire industry ecosystem of liquid cooling is not yet perfect, and there is great room for improvement in both cost and technology for liquid cooling products and solutions. The 6th CIME 2026 Shenzhen Data Center Liquid Cooling Industry Exhibition will showcase the latest products and technologies in the liquid cooling industry, establish brand image for enterprises, promote trade cooperation and market development, lead industry trends, strengthen production, research and development, and sales interaction, deeply understand the new development trends of the domestic and international liquid cooling industry market, explore new demands of the future liquid cooling industry market with a development perspective, innovate the connotation of the exhibition, organize professional visitors from all aspects and levels, and provide the best platform for technical exchange, product display, and trade negotiation for participating enterprises and merchants. The 6th Shenzhen International Data Center Liquid Cooling Industry Exhibition will be held from June 10-12, 2026 at the Shenzhen International Convention and Exhibition Center (New Hall). At that time, we warmly welcome domestic and foreign liquid cooling industry enterprises and related industry professionals to visit and exchange ideas!
Target audience: We mainly invite executives of enterprises in various scientific and technological fields, such as data center, power, electronics, aviation, aerospace vehicles, aircraft, medical care, communications, batteries, new energy, high-performance computing, edge computing, artificial intelligence, lithium battery equipment, energy storage, photovoltaic equipment, semiconductor equipment, automation, hydrogen energy, to visit and negotiate.

AI computing power/algorithm:Infrastructure server/storage, network equipment, optical communication/optical transmission, AI chip/DPU/CPU/GPU, storage chip, edge computing chip, edge computing, supercomputing center/intelligent computing center/edge data center, cloud services, Internet of Things, computing security, software applications;

Data center infrastructure:Infrastructure solutions for data centers, edge data center solutions, micro module data centers, air conditioning, cooling, and fresh air systems, power supply and distribution systems, comprehensive cabling systems, building and decoration materials for computer rooms, large screen display systems, fire protection systems, and security systems;

Liquid cooled raw materials:Including coolant, refrigerant, fluorinated liquid, silicone oil, mineral oil carbon dioxide/hydrogen, aqueous solution, etc;

Liquid cooling device:Cold plate liquid cooling products, metal cold plates, heating equipment and components, submerged liquid cooling products for liquid circulation equipment, heat dissipation devices, radiators, heat pipe fans, coolant, pumps, compressors, drive ring power components, temperature control components, thermostats/thermostats, temperature sensors, evaporators, condensers, expansion pots/coolant tanks, etc;

Pipelines and connectors:Rubber hoses, metal pipes, corrugated pipes, insulation pipes, water pipes/joints, cooling pipelines and connecting components, etc;

Auxiliary cooling equipment:Cooling fan, cooling material, enhanced heat sink, ambient air exchange equipment;

Core technology and equipment for liquid cooling:Including cold plate liquid cooling (including full liquid cold plate servers), immersion liquid cooling (single-phase/two-phase), and spray liquid cooling; Cold module decoupling design, intelligent temperature control system, fluid distribution technology: key components such as coolant (fluorinated liquid, mineral oil, etc.), cold plate, pump, valve, quick connector, heat exchanger: leakage detection equipment, intelligent sensors, phase change materials (PCM);