
2026-04-03
2026-06-10 - 2026-06-12
Shenzhen Liyue Exhibition Co., Ltd
Mechanical/Machine Tool/Industrial/Mold
Shenzhen, GD
Shenzhen International Exhibition Center
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Thank you for applying to participate in this exhibition. You only need to fill in the basic information to complete the application process. If you need further information, our service specialist will contact you via email.
After you submit your application, we will send a successful submission email to your email address to indicate that we have received your application. Please ensure the validity of your email address.
In addition to providing you with tickets and exhibition services, we can also offer more personalized services such as business travel services to make your experience more convenient and easy. If you have any questions or more needs about coming to China for conferences/exhibitions, please feel free to contact us at any time.
Please refer to the bottom of the page for details
With the sustained strong development demand in fields such as 5G, consumer electronics, automotive electronics, new energy vehicles, and semiconductors, new requirements have been put forward for the quality and quantity of precision ceramics. The rapid development of precision ceramic MLCC chip multilayer ceramic capacitors, LTCC low-temperature co fired ceramics, HTCC high-temperature co fired ceramics, ceramic substrates, ceramic copper-clad laminates, precision structural ceramics, piezoelectric ceramics, semiconductor ceramics and other products has greatly promoted the progress of major industries, with rapid development in both quantity and quality. The market itself holds great potential. Has broad development space. Faced with increasingly fierce competition in the international market, enterprises need to constantly absorb new knowledge and technology, adjust their production and sales concepts appropriately, and respond to the current development pattern.
In order to promote the upgrading and development of the precision ceramics and power semiconductor industry chain, strengthen communication and contact with industry buyers, and promote technological upgrading and transformation, the 2025 Shenzhen International Precision Ceramics and IGBT Industry Chain Exhibition, hosted by Bohan Exhibition and Liyue Exhibition, will be held simultaneously. The 15th Shenzhen International Thermal Conductive and Cooling Materials and Equipment Exhibition will be held at the Shenzhen International Convention and Exhibition Center from June 10 to 12, 2026. The exhibition will focus on showcasing the latest products and technologies in the precision ceramics and power semiconductor industry chain, establishing brand image for enterprises, promoting trade cooperation and market development, leading industry trends, strengthening production, research and development, and sales interaction. It will deeply understand the new trends in the future development of the precision ceramics and IGBT industry chain market at home and abroad, explore new demands in the future precision ceramics and IGBT industry chain market with a development perspective, innovate the connotation of the exhibition, and organize professional visitors from all aspects and levels, providing the best platform for technical exchange, product display, and trade negotiation for participating enterprises and merchants. At that time, we warmly welcome precision ceramic and power semiconductor industry chain enterprises and related industry professionals from home and abroad to visit and exchange ideas!
1. Ceramic devices and materials: MLCC, LTCC, HTCC, microwave dielectric ceramics, piezoelectric ceramics, barium titanate, barium carbonate, titanium oxide, aluminum oxide, zirconium oxide, glass powder, aluminum nitride, LTCC dielectric ceramic powder, rare earth oxides, ceramic strips, etc;
2. Precision ceramics: zirconia, alumina, aluminum nitride, silicon nitride, silicon carbide, yttrium oxide, structural ceramics, high-temperature ceramics, transparent ceramics, ceramic microbeads, new energy ceramics, ceramic bearings, ceramic balls, semiconductor ceramics (handling arms, ceramic cleavers, electrostatic chucks, etching rings...), 3D printed ceramics, fuel cell (SOFC) separators, wearable ceramics, fiber optic ceramic inserts, ceramic sleeves CIM、 Bioceramics, etc.
3. Ceramic substrate and packaging shell: ceramic packaging shell, DPC, DBC, AMB, HTCC substrate, LTCC substrate, thin film circuit board, thick film circuit board, ceramic packaging base, heat sink, aluminum oxide, aluminum nitride, silicon nitride, beryllium oxide, mullite powder and substrate, etc;
4. Metal materials: silver powder, gold powder, copper powder, nickel powder, solder (solder pads, solder paste), MLCC internal/external electrode paste, LTCC silver paste, gold paste, tungsten molybdenum paste, copper paste, target material, oxygen free copper strip, Kovar alloy, metal stamping parts, etc;
5. Additives: dispersants, adhesives, plasticizers, coagulants, mineralizers, defoamers, lubricants, sintering aids, etc. for ceramics and conductive slurries;
6. Ceramic processing equipment: sand mill, ball mill, vacuum defoaming machine, three roll machine, spray granulator, dry press, tape casting machine, injection molding machine, 3D printer, mold, drying equipment, grinder, precision engraving machine, cutting machine, laser equipment, punching machine, hole filling machine, screen printing machine, laminating machine, laminating machine, isostatic press, hot cutting machine, leveling machine, glue discharge furnace, sintering furnace, brazing equipment, electroplating equipment, chemical plating, silver spraying machine, silver dipping machine, silver terminal machine, vacuum coating equipment, developing equipment, film removal equipment, etching machine, wet process equipment, isoionic cleaning, ultrasonic cleaning, automation equipment Peel strength tester, AOI testing equipment, marking machine;
2. 1. Materials: silicon carbide, ceramic lining plate (DBC, AMB), packaging shell, bonding wire, heat dissipation base plate (copper, aluminum silicon carbide AlSiC), thermal conductive silicon gel, epoxy potting adhesive, solder (prefabricated solder), silver film/silver paste, radiator (copper, aluminum), power outlet terminal (copper terminal), shell (engineering plastic PPS, PBT, high temperature nylon), cleaning agent, etc;
2. 2. Equipment and accessories: vacuum welding furnace, surface mount machine, solidification machine, wire bonding machine X-ray、 Push pull testing machine, plasma cleaning equipment, dispensing machine, screen printing machine, ultrasonic scanning equipment, dynamic and static testing machine, point/glue filling machine, silver sintering equipment, vertical curing furnace, formic acid vacuum eutectic furnace, automatic sealing equipment, high-speed pin insertion machine, bending equipment, ultrasonic welding machine, visual inspection equipment, push pull testing machine, high and low temperature impact equipment, power cycle testing equipment, marking machine, inspection platform, fixture, etc;
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