On September 9-11, 2026, the 23rd Elexcon Shenzhen International Electronics Exhibition and Embedded Exhibition, hosted by Bowen Creative Exhibition, will be held simultaneously with the CIOE China Light Expo and IC Innovation Expo at the Shenzhen International Convention and Exhibition Center (Bao'an). Three exhibition linkage, with a total scale of 340000 square meters, jointly creating the preferred platform for the release and promotion of new technologies and products. As an important professional event focusing on electronic components and embedded technology in Shenzhen and southern China, elexcon 2026 will be themed "All for AI, All for Green". This exhibition will focus on showcasing core areas such as chips, storage, embedded and edge AI, power and power semiconductors, automotive electronics, electronic components and modules and solutions; The audience includes engineers, developers, procurement managers, and technical decision-makers from fields such as consumer electronics, automotive, communications, data centers, medical electronics, industrial control, and the Internet of Things.

Embedded AI and edge computing (MCU, MPU, SoC, FPGA, DSP), embedded modules, development boards, embedded operating systems, debugging and simulation tools, compilers, wired and wireless communication modules, sensors and actuators, power management IC, AIoT solutions, semiconductor IC, power semiconductor, testing and measurement, high-speed connection technology and connectors, harness cables and components, relays and switches, passive devices, MEMS sensors, storage, PCB and electronic manufacturing services, automotive electronics, optoelectronic and display technology, SiP advanced packaging and other products and technologies in the whole industry chain.