2026-04-09
2026-09-09 - 2026-09-11
博闻创意会展（深圳）有限公司
Musical Instruments/Games/Communication/Electronics
Shenzhen, GD
Shenzhen International Exhibition Center
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Thank you for applying to participate in this exhibition. You only need to fill in the basic information to complete the application process. If you need further information, our service specialist will contact you via email.
After you submit your application, we will send a successful submission email to your email address to indicate that we have received your application. Please ensure the validity of your email address.
In addition to providing you with tickets and exhibition services, we can also offer more personalized services such as business travel services to make your experience more convenient and easy. If you have any questions or more needs about coming to China for conferences/exhibitions, please feel free to contact us at any time.
Please refer to the bottom of the page for details
2026年9月9-11日，由博闻创意会展主办的 elexcon第23届深圳国际电子展暨嵌入式展 与 CIOE中国光博会、IC创新博览会将在深圳国际会展中心（宝安）同期举办。三展联动，总规模达 34 万平方米，共同打造新技术·新产品发布与推广首选平台。作为深圳及华南地区聚焦电子元器件与嵌入式技术的重要专业盛会，elexcon 2026将以 “All for AI，All for Green” 为主题，本届展会将重点展示芯片、存储、嵌入式与边缘 AI、电源与功率半导体、汽车电子、电子元器件及模块与方案 等核心板块；观众群体覆盖消费电子、汽车、通信、数据中心、医疗电子、工业控制、物联网 等领域的工程师、开发者、采购经理及技术决策者到场参观与交流。
嵌入式 AI 与边缘计算（MCU、MPU、SoC、FPGA、DSP）、嵌入式模块、开发板、嵌入式操作系统、调试与仿真工具、编译器、有线及无线通信模组、传感器与执行器、电源管理 IC、AIoT 解决方案、半导体 IC、功率半导体、测试与测量、高速连接技术及连接器、线束线缆与组件、继电器与开关、无源器件、MEMS 传感器、存储、PCB 与电子制造服务、汽车电子、光电与显示技术、SiP 先进封装等全产业链产品与技术。
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