2026-04-09
2026-09-09 - 2026-09-11
深圳市贺戎中芯展览有限公司
Mechanical/Machine Tool/Industrial/Mold
Shenzhen, GD
Shenzhen International Exhibition Center
Thank you for applying to participate in this exhibition. You only need to fill in the basic information to complete the application process. If you need further information, our service specialist will contact you via email.
After you submit your application, we will send a successful submission email to your email address to indicate that we have received your application. Please ensure the validity of your email address.
In addition to providing you with tickets and exhibition services, we can also offer more personalized services such as business travel services to make your experience more convenient and easy. If you have any questions or more needs about coming to China for conferences/exhibitions, please feel free to contact us at any time.
Please refer to the bottom of the page for details
Thank you for applying to participate in this exhibition. You only need to fill in the basic information to complete the application process. If you need further information, our service specialist will contact you via email.
After you submit your application, we will send a successful submission email to your email address to indicate that we have received your application. Please ensure the validity of your email address.
In addition to providing you with tickets and exhibition services, we can also offer more personalized services such as business travel services to make your experience more convenient and easy. If you have any questions or more needs about coming to China for conferences/exhibitions, please feel free to contact us at any time.
Please refer to the bottom of the page for details
原“SEMI-e深圳国际半导体展暨集成电路产业创新展”正式升级为IICIE国际集成电路创新博览会（IC创新博览会）！展会以“跨界融合 ·
全链协同，共筑特色芯生态”为主题，致力打造具备规模化效应、以应用为导向、以产品为核心的集成电路全产业链协同创新与交流合作高端展示平台。
展会呈现
IC 产品及应用、晶圆制造、封装测试、核心设备、关键材料及核心零部件的全链条生态布局。在这里，您既能与
IDM、Fabless、Fab、OSAT
等半导体核心领域企业深度对接，也能直面人工智能、消费电子、汽车、通信及计算、显示、光电、新能源等领域的广泛观众，一站式高效赋能下游关键领域。进一步促进集成电路产业与相关产业的融合发展，助力提升集成电路产业的核心竞争力，支撑我国集成电路产业高质量发展。
2026 IICIE 国际集成电路创新博览会展品覆盖集成电路全产业链，包括 AI 芯片、通信芯片、存储芯片、CPU、传感器、模拟 / 数字 / 电源管理 / 射频 / 驱动芯片等各类 IC 产品及应用；EDA 工具、IP 核、芯片设计、晶圆代工、封装测试（OSAT）等设计与制造服务；碳化硅、氮化镓等宽禁带半导体及功率器件；光刻机、刻蚀机、沉积、清洗、检测测试、封装等半导体制造 / 封测设备；硅片、光刻胶、特种气体、靶材、湿电子化学品、封装材料等半导体材料；以及密封圈、精密轴承、射频电源、石英 / 硅 / SiC / 陶瓷件、静电吸盘、流量计、机器视觉等半导体核心零部件
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