The original "SEMI-e Shenzhen International Semiconductor Exhibition and Integrated Circuit Industry Innovation Exhibition" has been officially upgraded to the IICIE International Integrated Circuit Innovation Expo (IC Innovation Expo)! The exhibition is themed "Cross border Integration, Full Chain Collaboration, Building a Characteristic Chip Ecology Together", committed to creating a high-end display platform for integrated circuit full industry chain collaborative innovation and exchange cooperation with scale effects, application-oriented, and product centered.
The exhibition presents a full chain ecological layout of IC products and applications, wafer manufacturing, packaging and testing, core equipment, key materials, and core components. Here, you can not only deeply connect with semiconductor core enterprises such as IDM, Fabless, Fab, OSAT, but also face a wide audience in fields such as artificial intelligence, consumer electronics, automotive, communication and computing, display, optoelectronics, and new energy, providing one-stop and efficient empowerment for downstream key areas. Further promote the integrated development of the integrated circuit industry and related industries, help enhance the core competitiveness of the integrated circuit industry, and support the high-quality development of China's integrated circuit industry.

The exhibits at the 2026 IICIE International Integrated Circuit Innovation Expo cover the entire integrated circuit industry chain, including AI chips, communication chips, storage chips CPU、 Various IC products and applications such as sensors, analog/digital/power management/RF/driver chips; EDA tools, IP cores, chip design, wafer foundry, packaging testing (OSAT) and other design and manufacturing services; Wide bandgap semiconductors and power devices such as silicon carbide and gallium nitride; Semiconductor manufacturing/packaging testing equipment such as lithography machines, etching machines, deposition, cleaning, testing, packaging, etc; Semiconductor materials such as silicon wafers, photoresist, specialty gases, target materials, wet electronic chemicals, and packaging materials; And semiconductor core components such as sealing rings, precision bearings, RF power supplies, quartz/silicon/SiC/ceramic parts, electrostatic suction cups, flow meters, machine vision, etc