From September 9-11, 2026, hosted by Bowen Creative ExhibitionThe 23rd Elexcon Shenzhen International Electronics Exhibition and Embedded System ExhibitionWe will join hands with CIOE China Optoelectronics Expo and IICIE International Integrated Circuit Innovation Expo to be held simultaneously at the Shenzhen International Convention and Exhibition Center (Bao'an). The total exhibition scale of the three exhibitions will reach 340000 square meters, committed to creating the industry's preferred platform for the release and promotion of new technologies and products, Shenzhen International Electronics.

As an important professional event focusing on electronic and embedded technology in Shenzhen and southern China, this exhibition aims to“All for AI，All for Green”As the theme, we will showcase cutting-edge technological achievements in key areas such as chips, storage, embedded and edge AI, power and power semiconductors, automotive electronics, electronic components and module solutions, attracting engineers, developers, procurement managers, and technical decision-makers from industries such as consumer electronics, automotive, communication, data centers, medical electronics, industrial control, and the Internet of Things to come and exchange ideas with Shenzhen International Electronics.

According to the organizers of the exhibition, this joint exhibition will gatherOver 5000 exhibiting companiesThe exhibition covers the entire industry chain of electronic embedded systems and optical chips, with exhibits ranging from basic electronic components, sensors, semiconductor chips, and development tools to terminal solutions such as AIoT, automotive electronics, and advanced packaging, presenting a comprehensive picture of the development of the electronics industry in Shenzhen International Electronics The exhibition is expected to welcomeOver 240000 professional visitorsAmong them, there are more than 7000 overseas visitors from 97 countries and regions around the world, providing efficient and accurate business opportunities for exhibitors.

The exhibition will be held concurrentlyOver 100 professional forum eventsInviting over 1000 top experts in the industry to give speeches. The 8th China Embedded Technology Conference, SiP China 10th System Level Packaging Conference, New Energy Vehicle Electronic Innovation Technology Forum, Solid State Transformer (SST) Technology Innovation Forum and other heavyweight theme conferences have been held in rotation, focusing on hot topics such as edge intelligence, robotics technology, storage, wireless networking, industrial embedded, and advanced packaging, creating a feast for industrial ideological exchange at Shenzhen International Electronics.

There are also multiple special themed zones set up on site, including Kaifa Gala Engineer/Developer Carnival Zone, SST Solid State Transformer Zone, RISC V Ecological Zone, and interactive activities such as AI Development Board Practical Workshop and Product Disassembly Show, creating practical communication scenes for technical R&D personnel. The exhibition covers embedded AI and edge computing, semiconductor IC, power semiconductor, connectors, passive devices, MEMS sensors, storage, PCB electronic manufacturing, automotive electronics, SiP advanced packaging and other categories, fully covering the upstream and downstream demand of Shenzhen International Power.

This three exhibition linkage will implement a one pass mode, breaking down barriers in the electronic, embedded, optoelectronic, and integrated circuit industries, building an integrated industrial platform for technology display, ideological collision, and business cooperation, and helping industry enterprises seize new opportunities for AI intelligence and green low-carbon development.

1. Chips and Semiconductor ICsAI chips, automotive/industrial grade chips, MCU/MPU/SoC/FPGA/DSP, SiP advanced packaging, Chiplet related technology products.
2. storageIndustrial grade storage, automotive grade storage, high bandwidth memory, emerging storage technologies, and related modules.
3. Embedded and Edge AIEmbedded processors, AI development boards, embedded operating systems, debugging and simulation tools, wired/wireless communication modules, edge gateways, AIoT complete implementation solutions.
4. Power Supply and Power SemiconductorsSiC/GaN third-generation semiconductor devices, power management ICs, industrial power supplies, solid-state transformers SST, thermal management, magnetic cores and other supporting products.
5. Automotive ElectronicsVehicle specification chips, onboard controllers, intelligent cockpits, automotive power devices, onboard communication, and automotive electronic supporting modules.
6. Electronic componentsPassive components such as resistive capacitive sensing, MEMS sensors, high-speed connectors, wiring harnesses and cables, relay switches, testing and measuring instruments.
7. Module and overall solutionVarious embedded modules, sensor actuators, PCBs, and electronic manufacturing services, providing system solutions for industries such as consumer electronics, industrial control, IoT, healthcare, and data centers.