IICIE International Integrated Circuit Innovation Expo (IC Innovation Expo)The iicieexpo will be held from September 9-11, 2026 at the Shenzhen International Convention and Exhibition Center (Bao'an). The exhibition, with the theme of "Cross border Integration and Full Chain Collaboration, Building a Distinctive Chip Ecology Together", will be held simultaneously and in the same location as the CIOE China Optoelectronics Expo and Elexcon Shenzhen International Electronics Exhibition. With just one certificate, you can have a comprehensive view of the three exhibitions and connect the entire industry chain of "chip device module solution application".

It is reported that IICIE has been upgraded from the original SEMI-e Shenzhen International Semiconductor Exhibition and Integrated Circuit Industry Innovation Exhibition, positioning itself as an application-oriented, product centered integrated circuit full industry chain collaborative innovation and exchange platform iicieexpo. This exhibition has a planned exhibition area of 50000 square meters, gathering more than 1100 exhibiting companies, and is expected to attract over 60000 professional visitors. It will also host more than 20 high-level industry conferences and events during the same period. Combined with two other major exhibitions, the total exhibition area of the three exhibitions reaches 320000 square meters, gathering over 5000 exhibiting companies. It is expected to attract more than 240000 professional visitors to visit and exchange ideas, deeply linking multiple industrial sectors such as semiconductor manufacturing, integrated circuits, optoelectronics, and electronic embedded systems.

The exhibits of this exhibition cover key tracks such as chip design and application, design and manufacturing services, wide bandgap semiconductors and power devices, semiconductor equipment, semiconductor materials, semiconductor core components, etc., fully covering the entire chain ecology of chip design, wafer manufacturing, packaging and testing, core equipment, key materials, and core components. IDM, Fabless, Fab, OSAT and other core enterprises in the industry chain will make concentrated appearances, targeting downstream industries such as artificial intelligence, automotive new energy, communication computing, consumer electronics, optoelectronics, and new energy, building supply and demand docking bridges, and helping industries efficiently match resources upstream and downstream.

To enhance the effectiveness of the exhibition, the organizer provides a variety of professional services. Provide one-on-one procurement docking services on-site and arrange exclusive 1v1 business talks for both supply and demand parties; Professional visitors who have completed online registration can receive a limited time free research report on the entire semiconductor industry chain, covering chips, advanced packaging, semiconductor equipment CPO、 Popular directions such as silicon photonics manufacturing and semiconductor materials. At the same time, professional visiting materials such as semiconductor industry chain map and pre exhibition preview manual are also provided to help visitors plan efficient exhibition routes.

The exhibition also features multiple industry forums focusing on AI+applications RISC‑V、 Cutting edge hotspots such as photolithography technology and advanced packaging gather industry experts and enterprise technical leaders to jointly analyze industry trends. The organizer expressed the hope to promote the cross-border integration of integrated circuits and multi application industries through this exhibition, strengthen the collaborative innovation capability of the domestic integrated circuit industry, and inject new momentum into the high-quality development of China's integrated circuit industry.

1. Chip Design and Application

AI chips, communication chips, storage chips CPU、 Sensor chips, analog/digital chips, power management chips, RF chips, driver chips; EDA tools, IP cores, design services, RISC V solutions, etc.

2. Wafer manufacturing

Process technologies and supporting products for wafer foundry, semiconductor manufacturing processes, thin film deposition, photolithography, etching, cleaning, measurement and testing.

3. Packaging testing& Advanced Packaging

Traditional packaging, 2.5D/3D packaging, wafer level packaging, Chiplet, SiP system level packaging; Testing equipment, probe station, testing machine, reliability testing equipment.

4. Semiconductor specialized equipment

Wafer processing equipment, lithography equipment, etching equipment, deposition equipment, cleaning equipment, slicing equipment, packaging equipment, automated factory equipment, robots.

5. Semiconductor key materials

Silicon wafer, photoresist, target material, special gas, polishing solution/pad, packaging substrate, bonding wire, plastic packaging material, ceramic packaging material, etc.

6. Compound semiconductors and wide bandgap power devices

Silicon carbide (SiC) and gallium nitride (GaN) materials; IGBT、MOSFET、 RF devices, new energy power modules.

7. Semiconductor core components

Vacuum valves, MFC flow meters, quartz components, electrostatic suction cups, precision motion modules, servo motors, machine vision, seals, refrigeration and temperature control equipment, etc.